Process Capability
- Lead free soldering / RoHS COB (Chip On Board)
- Dip soldering, wave soldering & hand soldering
- FFC hot bar soldering
- SMT components mounting
- BGA assembly & CSP assembly
- Plastic or metal casing assembly
- Heat seal connecting
- Conformal coating
- AOI (Automatic Optical Inspection)
- ICT (In-Circuit Testing)
- Functional testing
- Hi-pot testing
- Packaging
Operation Information
- 1,300 workers
- Production area 20,000 sqm.
- COB 8M Hits / Day
- Through hole components 5KK / Day
- SMT components 15KK / Day
